Lead-Free Solder Paste 138 Degrees Soldering Tin For Iphone Pcb Bga Led Protection Tin Mud Cpu Tin 30G/55G
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Model Number: Lead-free solder paste 138 degrees
Particle Size: 1-10μm
Storage environment: room temperature/cold
Suitable for1: iphoneX Circuit Board
Suitable for2: Repair mainboard Location
Melting Point: 138
100%: High Quality
Usage: PCB BGA Repairing Tool
Features 1: High Viscosity No-clean Flux
Features 2: Avoid the Pale Yellow Residue
Features 3: High Synthetic BGA Solder Flux
weight: 30g55g
Drop Ship: Support